The report highlights Winbond's commitment to corporate sustainability and details the company's progress in various areas, including environmental protection, social responsibility, and corporate governance. Key highlights include the introduction of the Task Force on Climate-related Financial Disclosures (TCFD) framework, a reduction in greenhouse gas emissions by 229,245 metric tons of CO2e, and the establishment of a new 12-inch wafer fab in Kaohsiung City's Luzhu Science Park, which adopts Winbond's independently-developed 25-nanometer compact manufacturing process technology.
Issuing Company Winbond Electronics Corporation
Report Type Sustainability Report
Report Language EN
Report Filesize 3.48 MB
No. of Pages 148 pages
Reporting periodJanuary 1, 2021-December 31, 2021
Report EditionUnknown
Assurance Provider BSI Taiwan
Reporting Standards GRI; SASB; AA1000 AccountAbility Principles (2018)
Materiality Assessmenttrue
